Disco Corporation (DISPF)
OTC Markets OTCPK · USD · Technology · Semiconductor Equipment & Materials
$321.97 (+7.70%) as of
Key statistics
- Market cap
- 34.92B
- P/E (TTM)
- 34.47
- EPS (TTM)
- 9.34
- Dividend yield
- 1.09%
- 52-week range
- 277.85 – 573.49
- Beta
- 1.00
- Revenue (TTM)
- 499.41B
- Profit margin
- 32.03%
- Volume
- 4.00
About Disco Corporation
Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines in Japan and internationally. The company offers precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, inspection systems, surface planers, and waterjet saws. It also provides precision processing tools, such as dicing blades, grinding wheels, and dry polishing wheels; and other products, such as accessory equipment, cut-off wheels, and related products. In addition, the company is involved in the maintenance, disassembly, and recycling of precision cutting, grinding, and polishing machines, as well as provides training services for the maintenance and operation of its machines. Further, it leases precision machines; and purchases and sells used machines. Additionally, the company manufactures and sells precision diamond abrasive tools; and offers chargeable processing services. Disco Corporation was founded in 1937 and is based in Ota, Japan.
- Sector
- Technology
- Industry
- Semiconductor Equipment & Materials
- Headquarters
- Ota, Japan
- Employees
- 5,547
Financial statements (income statement, balance sheet, cash flow) and an interactive price chart are available on this page with JavaScript enabled.